| 000 | 01144nam a2200277 4500 | ||
|---|---|---|---|
| 001 | 16045 | ||
| 010 |
_a0-944904-63-7 _bencadernado _dEsc 18 585$ |
||
| 090 | _a16045 | ||
| 100 | _a19950626d1993 k||y0pory50 ba | ||
| 101 | _aeng | ||
| 102 | _aUS | ||
| 200 |
_aMaterials in microelectronic and optoelectronic packaging _eproceedings of the International Symposium on Materials for Optoelectronic and Microelectronic packaging, presented at the Third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992 _fHung C. Ling, Koichi Niwa, Vishwa N. Shukla, ed. lit. |
||
| 210 |
_aWesterville, US _cThe American Ceramic Society _dcop. 1993 |
||
| 215 |
_aVIII, 471 p. _cil. _d24 cm |
||
| 225 |
_aCeramic transactions _v33 |
||
| 606 |
_aCerâmica _xTecnologia _910207 |
||
| 606 |
_aEmpacotamento microeletrónico _xMateriais _910505 |
||
| 606 |
_aDispositivos optoeletrónicos _xMateriais _910506 |
||
| 680 | _aTP807 | ||
| 702 |
_4340 _aLing _bHung C. _910507 |
||
| 702 |
_4340 _aNiwa _bKoichi _910509 |
||
| 702 |
_4340 _aShukla _bVishwa N. _910510 |
||
| 801 |
_gRPC _aPT |
||
| 942 |
_2lcc _cA _n0 |
||