Details for: Materials in microelectronic and optoelectronic packaging , proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic packaging, presented at the Third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992

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Materials in microelectronic and optoelectronic packaging : proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic packaging, presented at the Third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992 / Hung C. Ling, Koichi Niwa, Vishwa N. Shukla, ed. lit.

Secondary Author: ed. lit., Ling, Hung C.;ed. lit., Niwa, Koichi;ed. lit., Shukla, Vishwa N.Language: eng.Country: US - United States of America.Publication: Westerville, US : The American Ceramic Society, cop. 1993Description: VIII, 471 p. : il. ; 24 cmISBN: 0-944904-63-7.Series: Ceramic transactions, 33Subject - Topical Name: 10207 | 10505 | 10506

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Holdings
Item type	Current library	Collection	Call number	Copy number	Status	Date due	Barcode
Monografia	Biblioteca NOVA FCT Sala rosa/Piso 2	Não Ficção	TP807.CER FCT 26547 (Browse shelf(Opens below))	1	Available		0029311

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