Normal view MARC view ISBD view

Materials in microelectronic and optoelectronic packaging, proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic packaging, presented at the Third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992

Materials in microelectronic and optoelectronic packaging : proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic packaging, presented at the Third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992 / Hung C. Ling, Koichi Niwa, Vishwa N. Shukla, ed. lit.. - Westerville, US : The American Ceramic Society , cop. 1993 . - VIII, 471 p. : il. ; 24 cm. - (Ceramic transactions) ; 33

ISBN 0-944904-63-7

Cerâmica
Empacotamento microeletrónico
Dispositivos optoeletrónicos

LCC TP807

Print
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS
More searches

Search for this title in:
RUN B-On Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)